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What are the characteristics and advantages of thermal silicone film?

Classification:
Company News
Author:
Source:
2016/10/19 16:22
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[Abstract]:
Thermal silica gel film is made of silica gel substrate, adding metal oxide and other auxiliary materials, through a special process of synthesis of a thermal medium material

Thermal silica gel film is made of silica gel substrate, adding metal oxide and other auxiliary materials, through a special process of synthesis of a thermal medium material, in the industry, also known as thermal silica gel pads, thermal conductivity silicone film, soft thermal pad , Thermal conductivity of silicone gasket, etc., is designed to use the gap to pass the heat of the design of the program, to fill the gap, to complete the heat and heat dissipation parts of the heat transfer, but also play insulation, shock absorption, sealing and so on, to meet Equipment, miniaturization and ultra-thin design requirements, is a great process and usability, and the thickness of a wide range of applications, is an excellent thermal filler.

Specific application: LED industry use, automotive electronics industry applications, power industry, PDP / LED flat panel TV applications, communications industry, home appliance industry.

The main features of thermal silicone film:

Insulation, heat, wear, flame retardant, fill the gap, anti-compression, buffer and so on.

The advantages of thermal silicone film:

Material is soft, good compression performance, good thermal insulation properties, the thickness of the adjustable range is relatively large, suitable for filling the cavity, both sides with natural viscosity, operability and maintainability.

Thermal conductivity of silicone film in the thermal conductivity of the larger selectivity, from 0.8w / k.m ---- 3.0w / k.m above, and stable performance, long-term use of reliable.

Thermal conductivity double-sided adhesive is currently the maximum thermal conductivity of not more than 1.0w / k-m, the thermal effect is not ideal.

Thermal grease is a room temperature curing process, in the high temperature conditions are easy to produce surface chapped, unstable performance, easy to volatilize and flow, thermal conductivity will gradually decline, is not conducive to long-term reliable system operation.